Insulation performance analysis of novel higherature vacuum insulated panels with 2D and 2.5D braided structures

In this paper, the thermal insulation performance and mechanism of novel Higherature vacuum insulated panel (HTVIP) with 2D and 2.5D braided structures shell were compared and analyzed extensively. The effective thermal conductivity of 2.5D HTVIP ranged from 0.326 W m^-1•K^-1 to 0.748 W m^-1•K^-1 within the temperature from 25 °C to 900 °C is 12.4%-27.2% lower than the value of 2D HTVIP ranged from 0.368 W m^-1•K^-1 to 1.027 W m^-1•K^-1. The infrared images of both 2D and 2.5D HTVIP were also examined, which showed the 2.5D HTVIP has better thermal insulation performance. The thermal flow dynamic simulation of the HTVIP shows that the values of temperature at the center of the lower surface of the 2D and 2.5D HTVIP calculated by thermal simulation are 471 °C and 386 °C, respectively. And the heat flux density on the side of the 2.5D HTVIP is significantly lower than that of the 2D structure, the highest values are 163 KW m^-2•K and 105 KW m^-2•K, respectively.