Abstract
A novel π-complexation adsorbent is fabricated by grafting Cu(I)-containing molecule precursors onto β-cyclodextrin. The adsorbent provides a molecular-level dispersion of Cu(I), which is particularly beneficial to the adsorptive removal of aromatic sulfur thiophene, and is impossible to be realized through the conventional thermal method.
Original language | English |
---|---|
Pages (from-to) | 650-652 |
Number of pages | 3 |
Journal | Chemical Communications |
Volume | 47 |
Issue number | 2 |
DOIs | |
State | Published - 14 Dec 2011 |