Synthesis of Ag-Cu-Sn nanocrystalline alloys as intermediate temperature solder by high energy ball milling

Liangfeng Li; Tai Qiu; Jian Yang; Yongbao Feng

doi:10.4028/www.scientific.net/AMR.79-82.449

Synthesis of Ag-Cu-Sn nanocrystalline alloys as intermediate temperature solder by high energy ball milling

Liangfeng Li, Tai Qiu, Jian Yang, Yongbao Feng

College of Materials Science and Engineering

Nanjing Tech University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

To obtain intermediate temperature alloy solders with melting temperature of 400∼600°C, (Ag-Cu₂₈)-25Sn and (Ag-Cu₂₈)-30Sn alloys were prepared by high energy ball milling. Ag-Cu-Sn nanocrystalline alloys have been obtained after milling for 40h. XRD results show that the (Ag-Cu₂₈)-25Sn alloy consists of Ag₄Sn and Cu ₃Sn, and the (Ag-Cu₂₈)-30Sn alloy contains Ag ₄Sn, Cu₃Sn and Cu₆Sn₅. The small polydispersed particles with size ranging from 1um to about 25μm are observed from the (Ag-Cu₂s)-30Sn alloys milled for 40h by SEM. A large amount of small particles comprised of two or three grains are commonly observed by HRTEM, and average grain size is about 17.50nm. DSC results indicate that the melting points of the (Ag-Cu₂₈)-25Sn and (Ag-Cu₂₈)-30Sn alloys milled for 40h are 548.5°C and 539.3°C, respectively.

Original language	English
Title of host publication	Multi-Functional Materials and Structures II
Pages	449-452
Number of pages	4
DOIs	https://doi.org/10.4028/www.scientific.net/AMR.79-82.449
State	Published - 2009
Event	2nd International Conference on Multi-Functional Materials and Structures, MFMS-2009 - Qingdao, China Duration: 9 Oct 2009 → 12 Oct 2009

Publication series

Name	Advanced Materials Research
Volume	79-82
ISSN (Print)	1022-6680

Conference

Conference	2nd International Conference on Multi-Functional Materials and Structures, MFMS-2009
Country/Territory	China
City	Qingdao
Period	9/10/09 → 12/10/09

Keywords

Ag-cu-sn
Annealing
High energy ball milling
Intermediate temperature solder

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10.4028/www.scientific.net/AMR.79-82.449

Cite this

@inproceedings{93f17d0593fd4b81ac41377ba52d9ef7,

title = "Synthesis of Ag-Cu-Sn nanocrystalline alloys as intermediate temperature solder by high energy ball milling",

abstract = "To obtain intermediate temperature alloy solders with melting temperature of 400∼600°C, (Ag-Cu28)-25Sn and (Ag-Cu28)-30Sn alloys were prepared by high energy ball milling. Ag-Cu-Sn nanocrystalline alloys have been obtained after milling for 40h. XRD results show that the (Ag-Cu28)-25Sn alloy consists of Ag4Sn and Cu 3Sn, and the (Ag-Cu28)-30Sn alloy contains Ag 4Sn, Cu3Sn and Cu6Sn5. The small polydispersed particles with size ranging from 1um to about 25μm are observed from the (Ag-Cu2s)-30Sn alloys milled for 40h by SEM. A large amount of small particles comprised of two or three grains are commonly observed by HRTEM, and average grain size is about 17.50nm. DSC results indicate that the melting points of the (Ag-Cu28)-25Sn and (Ag-Cu28)-30Sn alloys milled for 40h are 548.5°C and 539.3°C, respectively.",

keywords = "Ag-cu-sn, Annealing, High energy ball milling, Intermediate temperature solder",

author = "Liangfeng Li and Tai Qiu and Jian Yang and Yongbao Feng",

year = "2009",

doi = "10.4028/www.scientific.net/AMR.79-82.449",

language = "英语",

isbn = "0878493042",

series = "Advanced Materials Research",

pages = "449--452",

booktitle = "Multi-Functional Materials and Structures II",

note = "2nd International Conference on Multi-Functional Materials and Structures, MFMS-2009 ; Conference date: 09-10-2009 Through 12-10-2009",

}

Li, L, Qiu, T , Yang, J & Feng, Y 2009, Synthesis of Ag-Cu-Sn nanocrystalline alloys as intermediate temperature solder by high energy ball milling. in Multi-Functional Materials and Structures II. Advanced Materials Research, vol. 79-82, pp. 449-452, 2nd International Conference on Multi-Functional Materials and Structures, MFMS-2009, Qingdao, China, 9/10/09. https://doi.org/10.4028/www.scientific.net/AMR.79-82.449

TY - GEN

T1 - Synthesis of Ag-Cu-Sn nanocrystalline alloys as intermediate temperature solder by high energy ball milling

AU - Li, Liangfeng

AU - Qiu, Tai

AU - Yang, Jian

AU - Feng, Yongbao

PY - 2009

Y1 - 2009

N2 - To obtain intermediate temperature alloy solders with melting temperature of 400∼600°C, (Ag-Cu28)-25Sn and (Ag-Cu28)-30Sn alloys were prepared by high energy ball milling. Ag-Cu-Sn nanocrystalline alloys have been obtained after milling for 40h. XRD results show that the (Ag-Cu28)-25Sn alloy consists of Ag4Sn and Cu 3Sn, and the (Ag-Cu28)-30Sn alloy contains Ag 4Sn, Cu3Sn and Cu6Sn5. The small polydispersed particles with size ranging from 1um to about 25μm are observed from the (Ag-Cu2s)-30Sn alloys milled for 40h by SEM. A large amount of small particles comprised of two or three grains are commonly observed by HRTEM, and average grain size is about 17.50nm. DSC results indicate that the melting points of the (Ag-Cu28)-25Sn and (Ag-Cu28)-30Sn alloys milled for 40h are 548.5°C and 539.3°C, respectively.

AB - To obtain intermediate temperature alloy solders with melting temperature of 400∼600°C, (Ag-Cu28)-25Sn and (Ag-Cu28)-30Sn alloys were prepared by high energy ball milling. Ag-Cu-Sn nanocrystalline alloys have been obtained after milling for 40h. XRD results show that the (Ag-Cu28)-25Sn alloy consists of Ag4Sn and Cu 3Sn, and the (Ag-Cu28)-30Sn alloy contains Ag 4Sn, Cu3Sn and Cu6Sn5. The small polydispersed particles with size ranging from 1um to about 25μm are observed from the (Ag-Cu2s)-30Sn alloys milled for 40h by SEM. A large amount of small particles comprised of two or three grains are commonly observed by HRTEM, and average grain size is about 17.50nm. DSC results indicate that the melting points of the (Ag-Cu28)-25Sn and (Ag-Cu28)-30Sn alloys milled for 40h are 548.5°C and 539.3°C, respectively.

KW - Ag-cu-sn

KW - Annealing

KW - High energy ball milling

KW - Intermediate temperature solder

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BT - Multi-Functional Materials and Structures II

T2 - 2nd International Conference on Multi-Functional Materials and Structures, MFMS-2009

Y2 - 9 October 2009 through 12 October 2009

ER -

Synthesis of Ag-Cu-Sn nanocrystalline alloys as intermediate temperature solder by high energy ball milling

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