Liquid metal/boron nitride thermal grease with optimized thermal conductivity and non-corrosive properties through interfacial modification

With the rise of electronic technologies, chip heat dissipation has become a critical challenge, spurring the need for advanced thermal interface materials. In this study, we developed a novel composite material by integrating boron nitride (BN) with liquid metal (LM) through surface modification using polyvinylpyrrolidone (PVP) and silane coupling agent (KH590). This modification enables the effective attachment of BN to the LM surface, forming a continuous thermal channel. When combined with polydimethylsiloxane (PDMS), KLM/BN@PVP/PDMS composite achieves a high thermal conductivity of 1.5 W/(m·K) and a low interfacial thermal resistance of 0.001565 (m²·K)/W. Importantly, the incorporation of BN not only reduces the fluidity of LM but also prevents LM from corroding aluminum substrates, ensuring the material's safety and stability. This innovative composite offers a promising solution to the heat dissipation challenges faced by electronic devices such as CPUs, GPUs, and LEDs, making it highly valuable for practical applications.