Preparation and thermal property analysis of Ag-Cu-In-Sn nano-powder

Xiuwen Yan, Tai Qiu, Liangfeng Li, Zhenzhong Zhang

科研成果: 期刊稿件文章同行评审

8 引用 (Scopus)

摘要

Chain shaped, well dispersal and nano-scale Ag-Cu-In-Sn powders were successfully prepared by DC arc plasma method. The structure, particle size and thermal properties were studied by XRD, TEM and TG-DSC. Results show that Ag-Cu-In-Sn powder with 45.03 nm particle size and homogeneous distribution can be produced by the optimized process. The powder has its unique thermal performance, and its melting point decreases by about 160°C compared with that of micro-scale powder.

源语言英语
页(从-至)330-333
页数4
期刊Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
37
2
出版状态已出版 - 2月 2008

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