@inproceedings{56ca1927010a4315ae39d1f0ca551a1f,
title = "Study on the Effects of Channel Deployment in a S-Shaped Liquid Cooling Heat Sink for Electronic Chip Cooling",
abstract = "The air conditioning in data center should be running in cold mode throughout the year account for amount of heat released in a relatively small space of rack. However, most of the heat in data center is released from electronic chips. Thus, the energy consumption of air conditioning will be significantly decreased if the heat released by electronic chips can be mitigated directly. Compared to the air cooling heat sink (ACHS), the cooling performance of liquid cooling heat sink (LCHS) is dramatically improved as it can remove more heat from the surface of electronic chip quickly. To further improve the cooling performance of LCHS, the effects of channel deployment are investigated in a commonly used S-shaped LCHS in this study. The numerical simulation results show that the average surface temperature of electronic chip can be reduced by 22.91 °C while the number of channels is increased from one to five.",
keywords = "Electronic chip cooling, Liquid heat sink, S-shaped",
author = "Zhihao Lu and Kai Zhang and Jinxiang Liu",
note = "Publisher Copyright: {\textcopyright} 2020, Springer Nature Singapore Pte Ltd.; 11th International Symposium on Heating, Ventilation and Air Conditioning, ISHVAC 2019 ; Conference date: 12-07-2019 Through 15-07-2019",
year = "2020",
doi = "10.1007/978-981-13-9520-8_10",
language = "英语",
isbn = "9789811395192",
series = "Environmental Science and Engineering",
publisher = "Springer",
pages = "87--95",
editor = "Zhaojun Wang and Fang Wang and Peng Wang and Chao Shen and Jing Liu and Yingxin Zhu",
booktitle = "Proceedings of the 11th International Symposium on Heating, Ventilation and Air Conditioning, ISHVAC 2019 - Volume 1",
address = "德国",
}
