Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

Jingjing Meng; Pengfei Chen; Rui Yang; Linli Dai; Cheng Yao; Zheng Fang; Kai Guo

doi:10.1016/j.cej.2021.128647

Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

Jingjing Meng, Pengfei Chen, Rui Yang, Linli Dai, Cheng Yao, Zheng Fang, Kai Guo

Nanjing Tech University

科研成果: 期刊稿件 › 文章 › 同行评审

62 引用（Scopus）

摘要

To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (T_max up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.

源语言	英语
文章编号	128647
期刊	Chemical Engineering Journal
卷	412
DOI	https://doi.org/10.1016/j.cej.2021.128647
出版状态	已出版 - 15 5月 2021

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title = "Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance",

abstract = "To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (Tmax up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.",

keywords = "Dielectric constant, Epoxy resin, Flame retardancy, Honokiol, Thermal conductivity, Thermal stability",

author = "Jingjing Meng and Pengfei Chen and Rui Yang and Linli Dai and Cheng Yao and Zheng Fang and Kai Guo",

note = "Publisher Copyright: {\textcopyright} 2021 Elsevier B.V.",

year = "2021",

month = may,

day = "15",

doi = "10.1016/j.cej.2021.128647",

language = "英语",

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TY - JOUR

T1 - Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

AU - Meng, Jingjing

AU - Chen, Pengfei

AU - Yang, Rui

AU - Dai, Linli

AU - Yao, Cheng

AU - Fang, Zheng

AU - Guo, Kai

PY - 2021/5/15

Y1 - 2021/5/15

N2 - To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (Tmax up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.

AB - To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (Tmax up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.

KW - Dielectric constant

KW - Epoxy resin

KW - Flame retardancy

KW - Honokiol

KW - Thermal conductivity

KW - Thermal stability

UR - http://www.scopus.com/inward/record.url?scp=85099811153&partnerID=8YFLogxK

U2 - 10.1016/j.cej.2021.128647

DO - 10.1016/j.cej.2021.128647

M3 - 文章

AN - SCOPUS:85099811153

SN - 1385-8947

VL - 412

JO - Chemical Engineering Journal

JF - Chemical Engineering Journal

M1 - 128647

ER -

Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

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