TY - JOUR
T1 - Improvement of electrical insulating properties for defective metal/epoxy resin interface in power modules by micro-plasma jet
AU - Zhu, Xi
AU - Guan, Xiuhan
AU - Dai, Luyi
AU - Cui, Xinglei
AU - Fan, Jiajie
AU - Fang, Zhi
N1 - Publisher Copyright:
© 2023 Elsevier B.V.
PY - 2023/11/30
Y1 - 2023/11/30
N2 - High-voltage power modules inevitably face the critical problem of electric field distortion at triple-junction point (Cu/insulation substrate/potting material) and accidental introduction of unexpected micro-metal defects on insulation substrate, which damages electrical insulating properties and induces breakdown. In this study, a novel precise surface treatment method based on atmospheric pressure micro-plasma jet (μ-APPJ) is proposed for rejuvenating and improving electrical insulating properties of defective Cu/epoxy resin (EP) substrate in power modules. Results show that a typical μ-APPJ with a diameter of about 200 μm is developed to precisely treat the micro-level metal defect in Cu/EP interface, and a spherical-clustered Si-containing functional film (∼Si-O4) can be fabricated on EP substrate by optimized Ar/Hexamethyldisiloxane (HMDSO)/μ-APPJ, which significantly enhances the hydrophobicity of EP surface. Moreover, the plasma-assisted film deposition around μm-defect improves interface electrical properties of defective Cu/EP samples, evidenced by higher flashover voltages and suppressed partial discharge. Further analysis based on simulations reveals that the deposited typical film not only promotes charge mobility and creepage distance on EP, but also introduces additional trap levels that capture electrons and inhibit electric field around metal defects, thereby suppressing partial discharge failure and improving electrical insulating properties.
AB - High-voltage power modules inevitably face the critical problem of electric field distortion at triple-junction point (Cu/insulation substrate/potting material) and accidental introduction of unexpected micro-metal defects on insulation substrate, which damages electrical insulating properties and induces breakdown. In this study, a novel precise surface treatment method based on atmospheric pressure micro-plasma jet (μ-APPJ) is proposed for rejuvenating and improving electrical insulating properties of defective Cu/epoxy resin (EP) substrate in power modules. Results show that a typical μ-APPJ with a diameter of about 200 μm is developed to precisely treat the micro-level metal defect in Cu/EP interface, and a spherical-clustered Si-containing functional film (∼Si-O4) can be fabricated on EP substrate by optimized Ar/Hexamethyldisiloxane (HMDSO)/μ-APPJ, which significantly enhances the hydrophobicity of EP surface. Moreover, the plasma-assisted film deposition around μm-defect improves interface electrical properties of defective Cu/EP samples, evidenced by higher flashover voltages and suppressed partial discharge. Further analysis based on simulations reveals that the deposited typical film not only promotes charge mobility and creepage distance on EP, but also introduces additional trap levels that capture electrons and inhibit electric field around metal defects, thereby suppressing partial discharge failure and improving electrical insulating properties.
KW - Defect inhibition
KW - Electrical properties improvement
KW - Metal/epoxy resin interface
KW - Plasma jet
KW - Precise treatment
UR - http://www.scopus.com/inward/record.url?scp=85165537564&partnerID=8YFLogxK
U2 - 10.1016/j.apsusc.2023.158064
DO - 10.1016/j.apsusc.2023.158064
M3 - 文章
AN - SCOPUS:85165537564
SN - 0169-4332
VL - 638
JO - Applied Surface Science
JF - Applied Surface Science
M1 - 158064
ER -