Microstructure and properties of (AgCu28)80InxSn(20-x) alloys

Xiu Wen Yan; Zhen Zhong Zhang; Tai Qiu

Microstructure and properties of (AgCu₂₈)₈₀In_xSn_(20-x) alloys

Xiu Wen Yan, Zhen Zhong Zhang, Tai Qiu

College of Materials Science and Engineering

Nanjing Tech University

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

(AgCu₂₈)₈₀In_xSn_(20-x) alloys can be prepared by means of the In and Sn additions. The microstructure, melting properties and spreading property were investigated by using XRD, SEM/EDS, DSC and spreading property test under different In and Sn contents. The results show that (AgCu₂₈)₈₀ In₁₁Sn₉ alloy has a low solidus temperature and melting range, a simple phase structure and a moderate spreading ratio. The optimization comprehensive property was at the addition of 11%In.

Original language	English
Pages (from-to)	1058-1060
Number of pages	3
Journal	Zhuzao Jishu/Foundry Technology
Volume	26
Issue number	11
State	Published - Nov 2005

Keywords

Melting properties
Microstructure
Solder
Spreadability

Cite this

@article{8ebad0beb6834d77a323dfb2f4ebe9e3,

title = "Microstructure and properties of (AgCu28)80InxSn(20-x) alloys",

abstract = "(AgCu28)80InxSn(20-x) alloys can be prepared by means of the In and Sn additions. The microstructure, melting properties and spreading property were investigated by using XRD, SEM/EDS, DSC and spreading property test under different In and Sn contents. The results show that (AgCu28)80 In11Sn9 alloy has a low solidus temperature and melting range, a simple phase structure and a moderate spreading ratio. The optimization comprehensive property was at the addition of 11%In.",

keywords = "Melting properties, Microstructure, Solder, Spreadability",

author = "Yan, {Xiu Wen} and Zhang, {Zhen Zhong} and Tai Qiu",

year = "2005",

month = nov,

language = "英语",

volume = "26",

pages = "1058--1060",

journal = "Zhuzao Jishu/Foundry Technology",

issn = "1000-8365",

publisher = "Xian Foundrymans Society",

number = "11",

}

TY - JOUR

T1 - Microstructure and properties of (AgCu28)80InxSn(20-x) alloys

AU - Yan, Xiu Wen

AU - Zhang, Zhen Zhong

AU - Qiu, Tai

PY - 2005/11

Y1 - 2005/11

N2 - (AgCu28)80InxSn(20-x) alloys can be prepared by means of the In and Sn additions. The microstructure, melting properties and spreading property were investigated by using XRD, SEM/EDS, DSC and spreading property test under different In and Sn contents. The results show that (AgCu28)80 In11Sn9 alloy has a low solidus temperature and melting range, a simple phase structure and a moderate spreading ratio. The optimization comprehensive property was at the addition of 11%In.

AB - (AgCu28)80InxSn(20-x) alloys can be prepared by means of the In and Sn additions. The microstructure, melting properties and spreading property were investigated by using XRD, SEM/EDS, DSC and spreading property test under different In and Sn contents. The results show that (AgCu28)80 In11Sn9 alloy has a low solidus temperature and melting range, a simple phase structure and a moderate spreading ratio. The optimization comprehensive property was at the addition of 11%In.

KW - Melting properties

KW - Microstructure

KW - Solder

KW - Spreadability

UR - http://www.scopus.com/inward/record.url?scp=28744437520&partnerID=8YFLogxK

M3 - 文章

AN - SCOPUS:28744437520

SN - 1000-8365

VL - 26

SP - 1058

EP - 1060

JO - Zhuzao Jishu/Foundry Technology

JF - Zhuzao Jishu/Foundry Technology

IS - 11

ER -

Microstructure and properties of (AgCu₂₈)₈₀In_xSn_(20-x) alloys

Abstract

Keywords

Other files and links

Fingerprint

Cite this