TY - JOUR
T1 - Molecular dynamics simulation on notch sensitivity of nanocrystalline Cu
AU - Wu, Hejun
AU - Tong, Shang
AU - Zhou, Jianqiu
AU - Zhang, Feng
AU - Yang, Baotong
N1 - Publisher Copyright:
© The Institution of Engineering and Technology 2018.
PY - 2018
Y1 - 2018
N2 - A molecular dynamics (MD) simulation was performed on the nanocrystalline (NC) Cu with an edge notch under tensile loadings, with focus on the notch sensitivity. With the increase of notch size, the dominant deformation of material changes from the shear strain, which spreads throughout the entire sample, to a single shear band, which is induced by the stress concentration at the notch root. At the same time, the samples move from notch-insensitivity to notch-sensitivity. These findings offer significant guidelines for the application of NC Cu in engineering.
AB - A molecular dynamics (MD) simulation was performed on the nanocrystalline (NC) Cu with an edge notch under tensile loadings, with focus on the notch sensitivity. With the increase of notch size, the dominant deformation of material changes from the shear strain, which spreads throughout the entire sample, to a single shear band, which is induced by the stress concentration at the notch root. At the same time, the samples move from notch-insensitivity to notch-sensitivity. These findings offer significant guidelines for the application of NC Cu in engineering.
UR - http://www.scopus.com/inward/record.url?scp=85058278254&partnerID=8YFLogxK
U2 - 10.1049/mnl.2018.5365
DO - 10.1049/mnl.2018.5365
M3 - 文章
AN - SCOPUS:85058278254
SN - 1750-0443
VL - 13
SP - 1724
EP - 1727
JO - Micro and Nano Letters
JF - Micro and Nano Letters
IS - 12
ER -