TY - GEN
T1 - Preparation and characterization of nickel plating graphite nanosheet filled conductive adhesive
AU - Zhang, Yi
AU - Qi, Shuhua
AU - Zhang, Fan
PY - 2012
Y1 - 2012
N2 - In this paper, nickel plating graphite nanosheet (Ni plating GN) was developed by electroless plating method using graphite nanosheet (GN). The Ni and P content on the surface of GN is 34.08wt% and 2.99wt% according to the elementary analysis. The electrically conductive adhesives (ECAs) comprised acrylate pressure -sensitive adhesive (acrylate PSA) and Ni plating GN was studied. TEM result showed that Ni plating GN is homogeneously dispersed in the acrylate PSA. The electrical conductivity of the ECAs increases to 3.14×10 -4 S/cm and the 180° peel strength and shear strength remains at a high level (180° peel strength about 0.58 MPa and shear strength about 0.48 MPa) when the content of Ni plating GN is 20 wt%.
AB - In this paper, nickel plating graphite nanosheet (Ni plating GN) was developed by electroless plating method using graphite nanosheet (GN). The Ni and P content on the surface of GN is 34.08wt% and 2.99wt% according to the elementary analysis. The electrically conductive adhesives (ECAs) comprised acrylate pressure -sensitive adhesive (acrylate PSA) and Ni plating GN was studied. TEM result showed that Ni plating GN is homogeneously dispersed in the acrylate PSA. The electrical conductivity of the ECAs increases to 3.14×10 -4 S/cm and the 180° peel strength and shear strength remains at a high level (180° peel strength about 0.58 MPa and shear strength about 0.48 MPa) when the content of Ni plating GN is 20 wt%.
KW - Acrylate resin
KW - Electrical conductivity
KW - Electrically conductive adhesive
KW - Mechanical properties
KW - Nickel plating graphite nanosheet
UR - http://www.scopus.com/inward/record.url?scp=84455192143&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.391-392.1100
DO - 10.4028/www.scientific.net/AMR.391-392.1100
M3 - 会议稿件
AN - SCOPUS:84455192143
SN - 9783037853337
T3 - Advanced Materials Research
SP - 1100
EP - 1104
BT - Chemical Engineering and Material Properties
T2 - 2011 International Symposium on Chemical Engineering and Material Properties, ISCEMP 2011
Y2 - 4 November 2011 through 6 November 2011
ER -