Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

Jingjing Meng; Pengfei Chen; Rui Yang; Linli Dai; Cheng Yao; Zheng Fang; Kai Guo

doi:10.1016/j.cej.2021.128647

Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

Jingjing Meng, Pengfei Chen, Rui Yang, Linli Dai, Cheng Yao, Zheng Fang, Kai Guo

Nanjing Tech University

Research output: Contribution to journal › Article › peer-review

63 Scopus citations

Abstract

To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (T_max up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.

Original language	English
Article number	128647
Journal	Chemical Engineering Journal
Volume	412
DOIs	https://doi.org/10.1016/j.cej.2021.128647
State	Published - 15 May 2021

Keywords

Dielectric constant
Epoxy resin
Flame retardancy
Honokiol
Thermal conductivity
Thermal stability

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1016/j.cej.2021.128647

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@article{52ae1990175a4230b26dc3c4b670eb12,

title = "Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance",

abstract = "To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (Tmax up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.",

keywords = "Dielectric constant, Epoxy resin, Flame retardancy, Honokiol, Thermal conductivity, Thermal stability",

author = "Jingjing Meng and Pengfei Chen and Rui Yang and Linli Dai and Cheng Yao and Zheng Fang and Kai Guo",

note = "Publisher Copyright: {\textcopyright} 2021 Elsevier B.V.",

year = "2021",

month = may,

day = "15",

doi = "10.1016/j.cej.2021.128647",

language = "英语",

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TY - JOUR

T1 - Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

AU - Meng, Jingjing

AU - Chen, Pengfei

AU - Yang, Rui

AU - Dai, Linli

AU - Yao, Cheng

AU - Fang, Zheng

AU - Guo, Kai

PY - 2021/5/15

Y1 - 2021/5/15

N2 - To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (Tmax up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.

AB - To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (Tmax up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.

KW - Dielectric constant

KW - Epoxy resin

KW - Flame retardancy

KW - Honokiol

KW - Thermal conductivity

KW - Thermal stability

UR - http://www.scopus.com/inward/record.url?scp=85099811153&partnerID=8YFLogxK

U2 - 10.1016/j.cej.2021.128647

DO - 10.1016/j.cej.2021.128647

M3 - 文章

AN - SCOPUS:85099811153

SN - 1385-8947

VL - 412

JO - Chemical Engineering Journal

JF - Chemical Engineering Journal

M1 - 128647

ER -

Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

Abstract

Keywords

UN SDGs

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