Numerical simulation and experimental verification on thermal performance of a novel fin-plate thermosyphon

Numerical investigation of a novel fin-plate thermosyphon (FPT), used to cool the high heat dissipation electronic devices, was performed. Three dimensional model of FPT is established using the Fluent software. The effects of fin pinch, fin thickness and fin type at the air side on thermal characteristics of FPT are presented with the air flow velocity various from 1.0 m/s to 4.0 m/s. The numerical results showed a good agreement with the corresponding experimental data. The heat transfer efficiency and pressure drops of FPT for plain fins were reduced by increasing the fin space. It also can be indicated that the cooling performance of FPT with serrated fins was better than plain fins for the same structural parameters.