Thermal conductivity enhancement of BN/silicone composites cured under electric field: Stacking of shape, thermal conductivity, and particle packing structure anisotropies

Yuwang Han, Sumin Lv, Chanxi Hao, Fei Ding, Yi Zhang

科研成果: 期刊稿件 › 文章 › 同行评审

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Material Science

Chemical Engineering

Engineering