3-D steady temperature field in a laminated rectangular plate

Hai Qian, Ding Zhou, Weiqing Liu, Hai Fang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

According to the exact three-dimensional (3D) thermal theory, the steady temperature distribution in a laminated rectangular plate with zero temperature conditions on four lateral surfaces was studied. An analytical method was developed to solve the temperature field in the plate. Firstly, the general solution of the temperature field in a single-layer rectangular plate, which exactly satisfies the governing thermal differential equation, was derived out. Then, the temperature and heat flux relationships between the upper surface and the lower surface of the single-layer plate were obtained. Based on the continuity of the temperature and the heat flux on the interface of two adjacent layers, the temperature and the heat flux between the lowest layer and the top layer of the laminated plate were recursively obtained by using the transfer matrix method. The unknown coefficients in the solutions for every layer were uniquely determined by the use of the temperature conditions at the upper and lower surfaces of the plate. The temperature distribution in the laminated plate was given by substituting the unknown coefficients obtained back to the recurrent formulae and the solutions. The convergence of the solutions has been checked based on the number of series term. Comparing the results with those obtained from the finite element method, the accuracy and correctness of the present method were demonstrated. Finally, the effects of surface temperatures, thickness, layer number and material properties of the plate on the temperature distribution were discussed in detail.

Original languageEnglish
Title of host publication2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014
PublisherAtlantis Press
Pages1285-1289
Number of pages5
ISBN (Electronic)9789462520424
DOIs
StatePublished - 2014
Event2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014 - Shenyang, China
Duration: 15 Nov 201417 Nov 2014

Publication series

Name2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014

Conference

Conference2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014
Country/TerritoryChina
CityShenyang
Period15/11/1417/11/14

Keywords

  • Displacement and stress
  • Exact solution
  • Laminated plate
  • Three-dimensional temperature field
  • Transfer matrix method

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