3-D steady temperature field in a laminated rectangular plate

Hai Qian, Ding Zhou, Weiqing Liu, Hai Fang

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

According to the exact three-dimensional (3D) thermal theory, the steady temperature distribution in a laminated rectangular plate with zero temperature conditions on four lateral surfaces was studied. An analytical method was developed to solve the temperature field in the plate. Firstly, the general solution of the temperature field in a single-layer rectangular plate, which exactly satisfies the governing thermal differential equation, was derived out. Then, the temperature and heat flux relationships between the upper surface and the lower surface of the single-layer plate were obtained. Based on the continuity of the temperature and the heat flux on the interface of two adjacent layers, the temperature and the heat flux between the lowest layer and the top layer of the laminated plate were recursively obtained by using the transfer matrix method. The unknown coefficients in the solutions for every layer were uniquely determined by the use of the temperature conditions at the upper and lower surfaces of the plate. The temperature distribution in the laminated plate was given by substituting the unknown coefficients obtained back to the recurrent formulae and the solutions. The convergence of the solutions has been checked based on the number of series term. Comparing the results with those obtained from the finite element method, the accuracy and correctness of the present method were demonstrated. Finally, the effects of surface temperatures, thickness, layer number and material properties of the plate on the temperature distribution were discussed in detail.

源语言英语
主期刊名2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014
出版商Atlantis Press
1285-1289
页数5
ISBN(电子版)9789462520424
DOI
出版状态已出版 - 2014
活动2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014 - Shenyang, 中国
期限: 15 11月 201417 11月 2014

出版系列

姓名2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014

会议

会议2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014
国家/地区中国
Shenyang
时期15/11/1417/11/14

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