TY - GEN
T1 - 3-D steady temperature field in a laminated rectangular plate
AU - Qian, Hai
AU - Zhou, Ding
AU - Liu, Weiqing
AU - Fang, Hai
N1 - Publisher Copyright:
© 2014. The authors - Published by Atlantis Press.
PY - 2014
Y1 - 2014
N2 - According to the exact three-dimensional (3D) thermal theory, the steady temperature distribution in a laminated rectangular plate with zero temperature conditions on four lateral surfaces was studied. An analytical method was developed to solve the temperature field in the plate. Firstly, the general solution of the temperature field in a single-layer rectangular plate, which exactly satisfies the governing thermal differential equation, was derived out. Then, the temperature and heat flux relationships between the upper surface and the lower surface of the single-layer plate were obtained. Based on the continuity of the temperature and the heat flux on the interface of two adjacent layers, the temperature and the heat flux between the lowest layer and the top layer of the laminated plate were recursively obtained by using the transfer matrix method. The unknown coefficients in the solutions for every layer were uniquely determined by the use of the temperature conditions at the upper and lower surfaces of the plate. The temperature distribution in the laminated plate was given by substituting the unknown coefficients obtained back to the recurrent formulae and the solutions. The convergence of the solutions has been checked based on the number of series term. Comparing the results with those obtained from the finite element method, the accuracy and correctness of the present method were demonstrated. Finally, the effects of surface temperatures, thickness, layer number and material properties of the plate on the temperature distribution were discussed in detail.
AB - According to the exact three-dimensional (3D) thermal theory, the steady temperature distribution in a laminated rectangular plate with zero temperature conditions on four lateral surfaces was studied. An analytical method was developed to solve the temperature field in the plate. Firstly, the general solution of the temperature field in a single-layer rectangular plate, which exactly satisfies the governing thermal differential equation, was derived out. Then, the temperature and heat flux relationships between the upper surface and the lower surface of the single-layer plate were obtained. Based on the continuity of the temperature and the heat flux on the interface of two adjacent layers, the temperature and the heat flux between the lowest layer and the top layer of the laminated plate were recursively obtained by using the transfer matrix method. The unknown coefficients in the solutions for every layer were uniquely determined by the use of the temperature conditions at the upper and lower surfaces of the plate. The temperature distribution in the laminated plate was given by substituting the unknown coefficients obtained back to the recurrent formulae and the solutions. The convergence of the solutions has been checked based on the number of series term. Comparing the results with those obtained from the finite element method, the accuracy and correctness of the present method were demonstrated. Finally, the effects of surface temperatures, thickness, layer number and material properties of the plate on the temperature distribution were discussed in detail.
KW - Displacement and stress
KW - Exact solution
KW - Laminated plate
KW - Three-dimensional temperature field
KW - Transfer matrix method
UR - http://www.scopus.com/inward/record.url?scp=84928042128&partnerID=8YFLogxK
U2 - 10.2991/meic-14.2014.285
DO - 10.2991/meic-14.2014.285
M3 - 会议稿件
AN - SCOPUS:84928042128
T3 - 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014
SP - 1285
EP - 1289
BT - 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014
PB - Atlantis Press
T2 - 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering, MEIC 2014
Y2 - 15 November 2014 through 17 November 2014
ER -