Investigation of shear-banding mechanism in fully dense nanocrystalline Ni sheet

Rongtao Zhu, Jianqiu Zhou, Xinbo Li, Hua Jiang, Xiang Ling

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

Evolution of shear banding in fully dense electrodeposited nanocrystalline Ni was successfully monitored by using a digital image correlation technique under a quasi-static uniaxial tensile load. To investigate the microscopic physical mechanism of the shear banding, in-situ tensile testing for the nanocrystalline Ni sample was conducted in a transmission electron microscope and fracture surface of the sample was examined by field emission scanning electron microscope. The results suggest that grain boundary migration based on atomic diffusion is a main carrier of the shear banding.

Original languageEnglish
Pages (from-to)396-401
Number of pages6
JournalMaterials Characterization
Volume61
Issue number4
DOIs
StatePublished - Apr 2010

Keywords

  • Digital image correlation
  • Fracture surface
  • In-situ TEM testing
  • Nanocrystalline Ni
  • Shear-banding mechanism

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