Abstract
Evolution of shear banding in fully dense electrodeposited nanocrystalline Ni was successfully monitored by using a digital image correlation technique under a quasi-static uniaxial tensile load. To investigate the microscopic physical mechanism of the shear banding, in-situ tensile testing for the nanocrystalline Ni sample was conducted in a transmission electron microscope and fracture surface of the sample was examined by field emission scanning electron microscope. The results suggest that grain boundary migration based on atomic diffusion is a main carrier of the shear banding.
Original language | English |
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Pages (from-to) | 396-401 |
Number of pages | 6 |
Journal | Materials Characterization |
Volume | 61 |
Issue number | 4 |
DOIs | |
State | Published - Apr 2010 |
Keywords
- Digital image correlation
- Fracture surface
- In-situ TEM testing
- Nanocrystalline Ni
- Shear-banding mechanism