摘要
Evolution of shear banding in fully dense electrodeposited nanocrystalline Ni was successfully monitored by using a digital image correlation technique under a quasi-static uniaxial tensile load. To investigate the microscopic physical mechanism of the shear banding, in-situ tensile testing for the nanocrystalline Ni sample was conducted in a transmission electron microscope and fracture surface of the sample was examined by field emission scanning electron microscope. The results suggest that grain boundary migration based on atomic diffusion is a main carrier of the shear banding.
源语言 | 英语 |
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页(从-至) | 396-401 |
页数 | 6 |
期刊 | Materials Characterization |
卷 | 61 |
期 | 4 |
DOI | |
出版状态 | 已出版 - 4月 2010 |