Preparation and thermal insulation analysis of SiCw-SiC foam with hollow skeletons via carbon foam template CVI method

Shengjie Yu, Zhaofeng Chen, Yang Wang, Ruiying Luo, Binbin Li, Zhou Chen, Ying Pan

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

SiCw-SiC foams with hollow skeleton were synthesized by a simple procedure that consisted of the chemical vapor infiltration (CVI) and oxidation process. Flexible carbon foam was employed as CVI template. A typical structure of SiCw-SiC foams consisting of SiC supporter with hollow skeleton structure accompanying numerous crooked SiC whiskers was obtained after burning out carbon skeleton of the carbon foam during oxidation process. SiCw-SiC foams have a density of 0.11 ≤ ρ ≤ 0.12 g/cm3, porosity ≥ 96% and a thermal conductivity at room temperature between 0.040 and 0.075 W/m·K. Thermal conductivity of the SiCw-SiC foams moderately increased with elevation of temperature, indicating that these foams with larger amount of whiskers exhibit excellent thermal insulation property at elevated temperature.

Original languageEnglish
Pages (from-to)296-301
Number of pages6
JournalMaterials Characterization
Volume134
DOIs
StatePublished - Dec 2017

Keywords

  • Chemical vapor infiltration
  • Foams
  • SiC
  • Thermal conductivity
  • Whiskers

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